SCMP BusinessAI 繁中編譯17/9 14:36 (HKT)
華為加快AI晶片步伐 承諾下一代提早三季推出
華為技術週四表示，將於2027年第一季推出新一代人工智能晶片，較原定目標提前九個月；正值中國推動自給自足之際，該公司正積極擴展其生態系統。David Wang Tao，輪值兼署理……
由 AI 自動翻譯自英文原文（保留香港新聞術語規範）
英文原標題：Huawei quickens AI chip pace, promises next entrant 3 quarters early
英文原摘要：Huawei Technologies said on Thursday that it would launch its next-generation artificial intelligence chip in the first quarter of 2027, moving the target launch forward by nine months as the firm aggressively expands its ecosystem amid China’s self-sufficiency push. David Wang Tao, rotating and act
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