SCMP BusinessAI 繁中編譯11/11 17:19 (HKT)
阿里巴巴籌備平頭哥晶片上市 香港新股熱潮降溫
阿里巴巴已申請旗下晶片設計部門平頭哥(T-Head)在香港上市,這家中國科技巨頭在首次公開招股(IPO)市場降溫之際,毅然籌集資金以實現人工智能(AI)雄心。香港交易所已批准有關分拆建議及保密上市申請。
由 AI 自動翻譯自英文原文（保留香港新聞術語規範）
英文原標題：Alibaba readies T-Head chip IPO as Hong Kong frenzy cools
英文原摘要：Alibaba has applied to list chip-design unit T-Head in Hong Kong, as the Chinese tech giant braves a cooling initial public offering (IPO) market to raise funds for artificial intelligence (AI) ambitions. The Hong Kong stock exchange has approved the proposed separation and a confidential listing ap